학술논문

Reconfigurable Writing Architecture for Reliable RRAM Operation in Wide Temperature Ranges
Document Type
Periodical
Source
IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 25(4):1224-1235 Apr, 2017
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Writing
Switches
Power demand
Temperature distribution
Integrated circuit reliability
Dynamic writing driver
memristor
reconfigurable
reliability
resistive RAM (RRAM)
temperature
Language
ISSN
1063-8210
1557-9999
Abstract
Resistive switching memories [resistive RAM (RRAM)] are an attractive alternative to nonvolatile storage and nonconventional computing systems, but their behavior strongly depends on the cell features, driver circuit, and working conditions. In particular, the circuit temperature and writing voltage schemes become critical issues, determining resistive switching memories performance. These dependencies usually force a design time tradeoff among reliability, device endurance, and power consumption, thereby imposing nonflexible functioning schemes and limiting the system performance. In this paper, we present a writing architecture that ensures the correct operation no matter the working temperature and allows the dynamic load of application-oriented writing profiles. Thus, taking advantage of more efficient configurations, the system can be dynamically adapted to overcome RRAM intrinsic challenges. Several profiles are analyzed regarding power consumption, temperature-variations protection, and operation speed, showing speedups near $700\times $ compared with other published drivers.