학술논문
Double Mold Antenna in Package for 77 GHz Automotive Radar
Document Type
Conference
Author
Source
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :257-261 Dec, 2020
Subject
Language
Abstract
A Fan-out wafer level package (FO-WLP) based Antenna in Package (AiP) test vehicle designed for 77 GHz have been demonstrated in this work. The AiP test vehicle is based on a double mold structure with 4 layers of redistribution lines. The RF device chips are embedded in the bottom mold compound layer, and the antenna arrays are fabricated on the top mold compound layer. This double mold structure was designed to reduce the form factor of AiP as the antenna arrays are fabricated directly on the top mold compound. The antenna structures were designed to meet a design target values of ∼12dBi gain and electrical simulation shows good electrical performance and radiation patterns over 77 to 81 GHz. Finally, the AiP test vehicles were fabricated using the “chip-first” process flow.