부산대학교 도서관

The demand for cooling performance on microelectronics package is in increasing trend due to the complexity of multi-chips packaging design and enhanced chips performances. This paper demonstrated the wafer level fabrication of embedded silicon heat sink and silicon-based liquid microchannel on metallic heating and sensing device. This thermal management solutions was designed to achieve high heat dissipation. 3.6um thick of metallic heater and sensor was used to deliver high power flow and direct embedded liquid cooling channel was fabricated at the opposite site of heating devices. Wafer level fabrication process integration flow was established. Process feasibility challenges issues and defectivities incurred were addressed. The respective solutions or process parameters optimization were discussed in this paper.