학술논문

Simultaneous, Submicron Infrared and Raman Microspectroscopies for Effective Failure and Contamination Analyses
Document Type
Conference
Source
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-6 Sep, 2021
Subject
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Stimulated emission
Surface contamination
Raman scattering
Surface morphology
Glass
Surface roughness
Rough surfaces
infrared
O-PTIR
FTIR
Raman
simultaneous
contamination
failure analysis
non-wetting
foreign matter
chemistry
submicron
diffraction-limited
Rayleigh criterion
Mie scattering
open circuit
residue
Language
ISSN
1946-1550
Abstract
We demonstrate the analysis of ~1 µm contamination with high signal-to-noise in a simultaneous infrared and Raman microscope at the same time, at the same location and at submicron spatial resolution. This combined technique provides high sensitivity to small sample volumes without melting or damaging the samples by using separate infrared excitation and visible laser detection mechanisms. The measurement process does not involve physically contacting the sample, hence simplifying sample preparation and avoiding cross-contamination between sample changes. To showcase this new capability, we provide examples from the contamination in the gap between a solder joint and a non-wetting pad, adhesive residues on a glass panel and foreign matter near a copper post. Such challenges could not be readily resolved with conventional FTIR and Raman techniques. The simultaneous O-PTIR and Raman brings complementary and confirmatory results to analysis previously thought to be difficult to impossible.