학술논문

Optimization of gate insulator material for GaN MIS-HEMT
Document Type
Conference
Source
2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2016 28th International Symposium on. :115-118 Jun, 2016
Subject
Components, Circuits, Devices and Systems
Power, Energy and Industry Applications
Gallium nitride
Logic gates
Hafnium compounds
HEMTs
Insulators
Leakage currents
SiO2
HfO2
La2O3
MIS
Ga HEMT
power device
Language
ISSN
1946-0201
Abstract
Metal-insulator-semiconductor (M-I-S) structure has been employed for GaN HEMTs to suppress gate leakage current. In this work, various gate insulator materials including SiO2, HfO2, La2O3, HfO2/SiO2 and La2O3/SiO2 were investigated for GaN MIS-HEMT application. It is found that GaN MIS-HEMT with La2O3/SiO2 composite oxide results in better device performance and reliability as compared to other gate insulator materials.