학술논문

Study on the Optimization of Off-State Breakdown Performance of p-GaN HEMTs
Document Type
Conference
Source
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2020 4th IEEE. :1-4 Apr, 2020
Subject
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Photonics and Electrooptics
Power, Energy and Industry Applications
Performance evaluation
Systematics
Electric breakdown
Logic gates
HEMTs
Leakage currents
Transistors
p-GaN
Normally-off
Breakdown
Language
Abstract
Normally-off Gallium Nitride (GaN) transistors with p-GaN gated technology for power applications are studied for the optimization of off-state breakdown performance. The gate-drain distance, gate length, field plate length and its configuration have been studied. Increase gate-drain distance will not only enhance the breakdown performance but also increase the $\mathrm{R}_{\mathrm{on}},\ \mathrm{L}_{\mathrm{GD}}$ between $10 -20\ \mu\mathrm{m}$ is recommended. Extra gate length will lead to the rising of the gate leakage current under high voltage. The overhang length of the field plate is a critical factor for breakdown performance, over placing the length of overhang may result in an additional current leakage path.