학술논문
Comparison of multilayer organic and ceramic package simultaneous switching noise measurements using a 0.16 /spl mu/m CMOS test chip
Document Type
Conference
Author
Source
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :1087-1094 2001
Subject
Language
ISSN
0569-5503
Abstract
This paper presents a comparison of simultaneous switching-output noise measurements taken with a 0.16 /spl mu/m CMOS test chip on two flip-chip multilayer packages: IBM's new HyperBGA/sup TM/ high-density PTFE-based organic BGA, and an existing IBM ASIC-menu alumina-ceramic BGA. In two classes of tests, measured transmitted noise from the organic BGA was found to average less than half that of the ceramic BGA. Technology and design features of the chip and package test vehicles are described and compared. Several types of simulations, including extracted loop inductance and full-wave simulation of coupling parameters, identify various noise components in each package and elucidate the large differences in measured noise between the two packages.