학술논문
Three-dimensional integrated optical interconnect with laser and photodetector on SOI substrate
Document Type
Conference
Author
Source
Technical Digest of the Eighteenth Microoptics Conference Microoptics Conference (MOC), 2013 18th. :1-2 Oct, 2013
Subject
Language
Abstract
A three-dimensional on-chip optical interconnect with laser and photodetector is demonstrated using guided-wave silicon optical bench with 45-degree micro-reflector. Three-dimensional optical path is employed to connect laser and photodetector. The optical coupling efficiency between laser and photodetector is −1.74dB. 5-Gbps error-free data transmission with 6mA laser bias is measured.