학술논문

Experimental characterization of packaged switch devices for RF and millimeter-Wave applications
Document Type
Conference
Source
2016 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Radio Frequency Integrated Circuits Symposium (RFIC), 2016 IEEE. :47-50 May, 2016
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineering Profession
Fields, Waves and Electromagnetics
Switches
Radio frequency
Semiconductor device measurement
Micromechanical devices
Switching circuits
Silicon
Performance evaluation
Circuit testing
MEMS
multi-port measurement
switches
Package/Board Deembedding
Chip-Package-PCB Co-Design
Language
ISSN
2375-0995
Abstract
In this paper we present experimental characterization of packaged switch devices in terms of their RF attributes: isolation, insertion loss, power consumption, and linearity. Packaging and Board assembly significantly reduce their RF and mm-Wave performances. A broadband experimental setup is developed for the qualification of packaged switch devices accounting for deembedding effects both with on-board/on-package and on-chip probing. Module-based switch devices have been measured then, plastic molding, Si cap, and bonding wires have been sequentially removed to investigate their influences. Different challenges with packaged switch devices are identified and effective solutions are proposed for their qualification.