학술논문
Fabrication and characterization of 3D integrated 2 DOF Micromirror Arrays for excessive thermal loads
Document Type
Conference
Author
Source
2011 IEEE 24th International Conference on Micro Electro Mechanical Systems Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on. :684-687 Jan, 2011
Subject
Language
ISSN
1084-6999
Abstract
This paper reports a high fill-factor (>90%), 2-dimensional analog micromirror array designed specifically for very high, optically induced thermal load applications. Each pixel can attain a mechanical DC rotation angle of ±4 degrees around any arbitrary axis with 170V excitation. The maximum temperature rise on the mirror surface with 7 KW/m 2 thermal load under 1 Pa ambient pressure is below 230 °C. A detailed assessment of the fabrication process - including the poly-Si vertical electrodes, wafer level mirror bonding, and copper electroplating of structural layers-, and characterization methodology is presented with experimental results.