학술논문
Achieving Spaceworthiness for Large-Size LTCC Packaging of Microwave MCM
Document Type
Conference
Source
2023 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON) Microwaves, Antennas, and Propagation Conference (MAPCON), 2023 IEEE. :1-4 Dec, 2023
Subject
Language
Abstract
This paper describes the various methodologies for realization of microwave subsystems through packaging of multiple bare MMICs. The use of LTCC substrate for packaging of hermetic multi-chip modules (MCM) has given significant benefits in terms of miniaturization and mass reduction. However, it poses several challenges for assembly and hermetic sealing of these large-size (>35 mm in both dimensions) LTCC modules. Various techniques for assembly and hermetic sealing were attempted and their outcomes are summarized.