부산대학교 도서관

Flip-chip LEDs have attracted more and more attentions for its benefits such as wire-bonding free, can be driven at higher current, and better thermal dispersion capability over horizontal or vertical ones. At the mean while, wafer-level packaging has been recognized as a kind of high productive and low cost packaging methodology for LEDs, and a lot of effort had been devoted for it in LED industry for recent years. As a combination of advanced chip and packaging technology, a kind of silicon based wafer-level packaging technology which integrated with advanced process such as through silicon via (TSV), chip to wafer (C2W), and conformal phosphor for flip-chip LEDs was introduced. The electrical, optical, chromatic and thermal performance of the packaged LEDs which processed based on the 8 inch silicon wafers had been characterized, as well as the reliability had been tested.