학술논문
Novel 3D force sensor using ultra-thin silicon strain gauge bonded on metal membrane
Document Type
Conference
Author
Source
TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International. :1920-1923 Jun, 2009
Subject
Language
ISSN
2159-547X
2164-1641
2164-1641
Abstract
In the present paper, we propose a novel 3D force sensor design using a silicon strain gauge bonded on a metal diaphragm. The fabrication process and glass frit bonding process of the ultra-thin silicon strain gauges having a thickness of 50 µm were established; afterward, performance of the silicon strain gauge bonded on the stainless steel cantilever beam was evaluated at the various conditions. In results, resistance linearly increased with deformation by tensile stress, and gauge factor representing the sensitivity of the strain gauge was 33.77. Nonlinearity and hysteresis were respectively 0.21%FS and 0.17%FS.