학술논문

Analysis on Trapping Kinetics of Stress-Induced Trapped Holes in Gate Dielectric of Amorphous HfInZnO TFT
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 63(6):2398-2404 Jun, 2016
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Logic gates
Thin film transistors
Stress
Frequency measurement
Electron traps
Insulators
C-V analysis on metal-oxide thin-film transistors (TFTs)
hafnium-indium-zinc-oxide (HIZO) TFTs
stress-induced trapped hole distribution.
Language
ISSN
0018-9383
1557-9646
Abstract
A comprehensive study was done regarding stability under simultaneous stress of light and negative gate dc bias in amorphous hafnium–indium–zinc-oxide ( $\alpha $ -HIZO) thin-film transistors. A negative threshold voltage ( $V_{\mathrm{ th}})$ shift and an anomalous hump were observed in transfer characteristics after the stress, and it is explained that these phenomena are caused by the hole trapping in the SiO 2 gate insulator, not by interface state generation. Furthermore, capacitance–voltage ( $C_{G}$ – $V_{G})$ measurements were performed with various frequencies to investigate the vertical distribution of the trapped holes in the gate insulator. As a result, the correlation between the vertical location of the trapped holes and the influence on $C_{G}$ – $V_{G}$ characteristics were revealed clearly. First, at the beginning of the stress, photogenerated holes are mainly trapped at the $\alpha $ -HIZO/SiO 2 interface and interfacial SiO 2 in contact with the interface, which induces the negative $V_{\mathrm{ th}}$ shift. Second, as the stress time increases, the holes start to be trapped in the spatially deeper insulator, which leads to an additional hump in the $C_{G}$ – $V_{G}$ characteristics at sufficiently low frequencies.