학술논문
Design intent utilization for lithography compliance check and layout refinement to improve manufacturability
Document Type
Conference
Author
Source
2011 e-Manufacturing & Design Collaboration Symposium & International Symposium on Semiconductor Manufacturing (eMDC & ISSM) Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on. :1-17 Sep, 2011
Subject
Language
ISSN
1523-553X
Abstract
• Design rule shrinkage causes a problem with critical circuit performance vulnerable to process variability. • Design-aware manufacturing flow to clarify the design intent and control CD spec. in manufacturing is proposed. • This flow implemented an extraction and automatic fixing in electrically critical spot based on design intent of EM and crosstalk. • Combination of design intent and automatic hot spot fixer is available for desired circuit pattern without burden. • This flow is expected to drastically reduce the lead time and cost in both design and manufacturing.