학술논문
Large-scale photonic integrated circuits
Document Type
Periodical
Author
Nagarajan, R.; Joyner, C.H.; Schneider, R.P., Jr.; Bostak, J.S.; Butrie, T.; Dentai, A.G.; Dominic, V.G.; Evans, P.W.; Kato, M.; Kauffman, M.; Lambert, D.J.H.; Mathis, S.K.; Mathur, A.; Miles, R.H.; Mitchell, M.L.; Missey, M.J.; Murthy, S.; Nilsson, A.C.; Peters, F.H.; Pennypacker, S.C.; Pleumeekers, J.L.; Salvatore, R.A.; Schlenker, R.K.; Taylor, R.B.; Huan-Shang Tsai; Van Leeuwen, M.F.; Webjorn, J.; Ziari, M.; Perkins, D.; Singh, J.; Grubb, S.G.; Reffle, M.S.; Mehuys, D.G.; Kish, F.A.; Welch, D.F.
Source
IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 11(1):50-65 Jan, 2005
Subject
Language
ISSN
1077-260X
1558-4542
1558-4542
Abstract
100-Gb/s dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are demonstrated. The transmitter is realized through the integration of over 50 discrete functions onto a single monolithic InP chip. The resultant DWDM PICs are capable of simultaneously transmitting and receiving ten wavelengths at 10 Gb/s on a DWDM wavelength grid. Optical system performance results across a representative DWDM long-haul link are presented for a next-generation optical transport system using these large-scale PICs. The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption.