학술논문
Advanced Measurement and Simulation Approach for DDR5 On-chip SI/PI with the Probing Package
Document Type
Conference
Author
Source
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2022 IEEE 31st Conference on. :1-3 Oct, 2022
Subject
Language
ISSN
2165-4115
Abstract
As the operation of server system is accelerated, the importance of signal integrity (SI) and power integrity (PI) measurement methodology and modeling of dual in line memory module (DIMM) products is increasing. In this paper, we introduce the advanced methodology for on-chip SI/PI measurement and DRAM signal recovery with the DDR5 probing package development. Comparing with the conventional interposer, a new method of probing package has proved to be advantageous for high-speed signal measurement and signal recovery, and it can also be used as a useful tool for DRAM on-chip SI measurement and signal prediction in post DDR5 speed (beyond 6.4 Gbps).