학술논문

Numerical/Experimental Hybrid Approach to Predict Warpage of Thin Advanced Substrates
Document Type
Conference
Source
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :267-272 May, 2018
Subject
Components, Circuits, Devices and Systems
Substrates
Gratings
Computational modeling
Fixtures
Sensitivity
Temperature measurement
Layout
SM-NT
O/DFM
trace mapping
hybrid substrate model
Language
ISSN
2377-5726
Abstract
A hybrid approach is proposed to enhance warpage predictability of thin advanced substrates. Experimental warpage data of the substrates is first obtained under various conditions. High sensitivity measurements (a contour interval of 6.25 microns/fringe or equivalent to shadow moiré with a grating of 160 lines/mm) "without" painting the surface becomes possible through the advanced shadow moiré method called Shadow Moiré with Non-zero Talbot Distance (SM-NT) in conjunction with the optical/digital fringe multiplication (O/DFM) method. The measured warpage is combined with an FEA approach called trace mapping to incorporate the effect of the copper trace layouts into the analysis. A hybrid model is created through calibration of the properties most critical to warpage, and the warpage values of the substrates at reflow temperature are predicted.