학술논문

Selective Metallization of 3D Printable Thermoplastic Polyurethanes
Document Type
Periodical
Source
IEEE Access Access, IEEE. 7:104947-104955 2019
Subject
Aerospace
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Fields, Waves and Electromagnetics
General Topics for Engineers
Geoscience
Nuclear Engineering
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Transportation
Copper
Plating
Three-dimensional displays
Ions
Substrates
Printing
Thermoplastic polyurethane elastomers (TPU)
fused filament fabrication (FFF)
3D printing
additive manufacturing (AM)
hybrid-AM
silver nanoparticles (Ag NPs)
electroless copper plating
FilaFlex®
SemiFlex™
PolyFlex™
NinjaFlex®
Language
ISSN
2169-3536
Abstract
This paper presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex ® , SemiFlex™, PolyFlex™, and NinjaFlex ® . Silver nanoparticles were fabricated in-situ by photo-reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) m $\Omega /\Box $ and a copper conductivity of (1.1 ± 0.1) $\times 10^{{7}}$ S/m that is comparable with bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.