학술논문

A very low cost, 3-axis, MEMS accelerometer for consumer applications
Document Type
Conference
Source
2009 IEEE Sensors Sensors, 2009 IEEE. :953-957 Oct, 2009
Subject
Photonics and Electrooptics
Costs
Micromechanical devices
Accelerometers
Plastic packaging
Testing
Stacking
Design methodology
Mechanical sensors
Sensor phenomena and characterization
Acceleration
Language
ISSN
1930-0395
Abstract
We report here on a novel 3-axis MEMS accelerometer intended to meet the requirements of a high volume, very low cost sensor in consumer gaming and hand-held applications. In order to balance the performance and cost requirements of such applications, this device achieves 3-axis sensing with a single proof-mass. This accomplishment required significant process, device, and test design novelty. Because of the extreme cost constraints in these markets, this design reexamines the core system trade-offs between single-chip integrated and 2-chip MEMS solutions. A 2-chip solution was chosen in this case. Minimizing package costs lead to the use of chip stacking in an over-molded plastic package. Finally, a sophisticated method of probing the sensor-only die was developed, which allowed the further development of a “no-shake” sensitivity trim algorithm which does not require mechanical stimulation of the device. Based on the design methodologies described here, a very low cost sensor with superior performance was achieved. The acceleration sensitivity achieved is 300mV/g with a noise limited resolution of 150 µg/√Hz. The offset voltage temperature coefficient is less than 0.3mV/degC.