학술논문
Low-temperature die attach material
Document Type
Conference
Author
Source
1992 Proceedings 42nd Electronic Components & Technology Conference Electronic Components and Technology Conference, 1992. Proceedings., 42nd. :234-238 1992
Subject
Language
Abstract
Describes the development of glasses for silver glass die attach application at temperature below 400 degrees and as low as 260 degrees C. It is observed that the basic principle of the nonbridging oxygen formulation mechanism can be used to design glasses in the development of new silver glass composites. These new composites were shown to perform at lower application temperatures with similar or better reliability than the original lead borate glass based silver composite. It was demonstrated that glass composition, glass transition temperature, and glass crystallization behavior were key to the ultimate performance of the composite.ETX