부산대학교 도서관

USB Power Delivery is an almost new topic which is growing in the past few years. Power negotiation for fast charging is the main intent of this standard The Type-C connector includes power and high-speed data pins. Power delivery was being done through off-chip PFET (or NFET) in early generations of PD controller chips, but more recently they are being integrated Integration of Load switches that potentially carry high current requires larger pads while integration of high speed USB switches need small pads. A trade-off between the number of pads, the size of the pads, requirements for supporting all functionality and passing high currents, makes floor-planning a challenging job. There are many integrated sub blocks to perform all the needed functionality that is being controlled by a sophisticated digital state machine. Accurate thermal analysis must be done to calculate a realistic junction temperature. The lifetime of the pads and the chip must be calculated based on real power delivery scenarios and a real junction temperature. This exercise has been done for a product which is integrated in a single die 0.14 $\mu m$ CMOS process, 49-pin chip in WLCSP49, 3. $15 * 3.15 * 0.49 mm^{3}$, 0.4 mm pitch with ambient temperature supported from −40 to $85^{\mathrm {o}}C.$