학술논문

Creation and use compact thermal models for virtual prototyping of electronic assemblies from a semiconductor companies perspective
Document Type
Conference
Source
20th International Workshop on Thermal Investigations of ICs and Systems Thermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on. :1-6 Sep, 2014
Subject
Components, Circuits, Devices and Systems
Junctions
Conferences
Temperature measurement
Silicon
Linear programming
Integrated circuit modeling
Language
Abstract
Compact Thermal Models (CTMs) are now in use for more than 10 years. We have come a long way since the first introduction of the CTMs half way the nineties [1] [2]. This paper will give an overview of problems that still existed from the moment CTMs were introduced, how they were solved, and what must be done to make better use of this technology