학술논문

Process and chamber health monitoring of plasma enhanced ti deposition process through high performance VI-probe
Document Type
Conference
Source
2007 International Symposium on Semiconductor Manufacturing Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on. :1-4 Oct, 2007
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Monitoring
Plasma applications
Plasma measurements
Plasma materials processing
Sensor phenomena and characterization
Plasma properties
Inductors
Plasma devices
Signal processing
Probes
Language
ISSN
1523-553X
Abstract
As an alternative to plasma sensors, high performance VI probe was evaluated in a plasma enhanced Ti deposition process. Its utilization was focused on finding any reasonable differences between good and bad chambers classified in terms of end of line yield data. Some differences of delivered power and time trace current signal between chambers were found, which well matches the good and bad chamber classification. Also, a fault detection and classification algorithm to handle huge amount of raw VIprobe data was evaluated. The algorithm estimates deviation of TiCl4 content in plasma occurs right after preventive maintenance, which might be considered as a chamber conditioning procedure. Despite requiring additional evaluations, the combination of VI-probe and welldeveloped algorithm might be a feasible solution where conventional plasma sensors can not be applied.