학술논문

A 16nm FinFET CMOS technology for mobile SoC and computing applications
Document Type
Conference
Source
2013 IEEE International Electron Devices Meeting Electron Devices Meeting (IEDM), 2013 IEEE International. :9.1.1-9.1.4 Dec, 2013
Subject
Components, Circuits, Devices and Systems
FinFETs
Metals
High definition video
Random access memory
Logic gates
Language
ISSN
0163-1918
2156-017X
Abstract
For the first time, we present a state-of-the-art energy-efficient 16nm technology integrated with FinFET transistors, 0.07um 2 high density (HD) SRAM, Cu/low-k interconnect and high density MiM for mobile SoC and computing applications. This technology provides 2X logic density and >35% speed gain or >55% power reduction over our 28nm HK/MG planar technology. To our knowledge, this is the smallest fully functional 128Mb HD FinFET SRAM (with single fin) test-chip demonstrated with low Vccmin for 16nm node. Low leakage (SVt) FinFET transistors achieve excellent short channel control with DIBL of