학술논문

The development of the high performance parallel-stacked RF spiral inductor
Document Type
Conference
Source
2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. MEMS/MOEMS '09. Symposium on. :424-427 Apr, 2009
Subject
Computing and Processing
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Radio frequency
Spirals
Inductors
CMOS process
Process design
Finite element methods
Q measurement
Frequency measurement
Semiconductor device measurement
Electromagnetic measurements
Language
Abstract
In this work, deep sub-micron CMOS process compatible high Q on chip spiral inductors with air- gap structure and parallel stacked inductor have been fabricated with 0.18µm CMOS compatible process. In the design the electromagnetic solver, SONNET, and the finite element program, ANSYS, were used for electrical-characteristics and maximum mechanical strength, respectively. Experimental results show that measured peak Q and peak-Q frequency attain 7.06 and 1.8GHz for the structure of four metal layers parallel and metal width of 15um at 5.5 turns, respectively and 5.2 and 1.6GHz for the suspending spiral inductor. Besides, the experimental results also shows the parallel stacked structure saves the chip area significantly and reduces resistance to obtain high Q value at low frequency significantly.