학술논문

Fast End-to-end Channel Electrical Characterization Methodology for Design and Manufacture Quality Check
Document Type
Conference
Source
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineering Profession
Robotics and Control Systems
Micromechanical devices
Transmitters
Receivers
Packaging
Robustness
Reproducibility of results
Product design
Language
ISSN
2150-5942
Abstract
This end-to-end methodology from the transmitter, channel to the receiver, is proposed and established for fast, robustness, and accurate PCB characterization to validate design and manufacture quality. The advanced de-embedding with 2x-Thru is adopted to remove the probing effect effectively. Meanwhile, the measurement robustness is validated by intensive repeatability and reproducibility experiments. Through this proposed approach, designers can identify the critical design issues symmetrically and improve the product quality on early design phase by efficient channel loss and system impedance verification.