학술논문

Yield and Scaling Improvements in Next-Generation 2.5 THz SLCFET Devices to Enable Ultra-wideband DC-110GHz Switch MMICs
Document Type
Conference
Source
2021 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2021 IEEE. :1-4 Dec, 2021
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
General Topics for Engineers
Photonics and Electrooptics
Power, Energy and Industry Applications
Fabrication
Planarization
Field effect transistors
Superlattices
Insertion loss
Switches
Wide band gap semiconductors
AlGaN/GaN
SLCFET
RFswitches
device scaling
yield improvement
THz circuits
Language
Abstract
This paper reports improvements in the Superlattice Castellated Field Effect Transistor (SLCFET) 10-channel device process to enable fabrication of ultra-wideband DC-110GHz Single Pole Double and Triple Throw (SPDT/SP3T) MMICs. The 10-channel SLCFET device offers higher performance, but is more difficult to fabricate. Through planarization of the device contact pads, the fabrication of the gate electrode is improved, thereby improving DC yield for the devices by more than 50%. Additionally, the planarization has enabled the scaling of the device source/drain spacing to 64% of baseline devices while maintaining a greater than 50% DC yield. The decrease in the source/drain spacing reduces on-resistance while minimally impacting the off-capacitance, leading to a higher achievable switch Figure of Merit Fco >3THz. The improved FET designs demonstrated improved insertion loss in the wideband SPDT and SP3T MMICs while showing no change in isolation. These ultra-wideband MMICs offer better insertion loss and bandwidth than is possible from other conventional technologies.