학술논문

Degradations of Threshold Voltage, Mobility, and Drain Current and the Dependence on Transistor Geometry For Stressing at 77 K and 300 K
Document Type
Periodical
Source
IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 14(1):477-483 Mar, 2014
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Power, Energy and Industry Applications
Degradation
Transistors
Stress
Threshold voltage
Liquids
Nitrogen
Temperature measurement
Cryogenic temperature
drain current degradation
hot-carrier effect
mobility degradation
stress tests
threshold voltage degradation
Language
ISSN
1530-4388
1558-2574
Abstract
Based on test results and a procedure that can isolate threshold voltage degradation and mobility degradation from drain current degradation, we found that the log–log curves of mobility degradation show saturation with a change of slope from about 0.4 to smaller values at room temperature. Although both the mobility and threshold voltage degradations are more severe at 77 K than at 300 K for the same stress time, the temperature effect on the mobility degradation is larger than that on the threshold voltage degradation. In addition, the degradations of transistors with three different widths are compared after the stress tests at room and cryogenic temperatures, leading to the observation of degradation dependence on the transistor width. It is observed that the width dependence is more evident at 300 K, and the temperature plays a more significant role on the degradation for larger width transistors.