학술논문
Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
Document Type
Conference
Author
Vandooren, A.; Witters, L.; Franco, J.; Mallik, A.; Parvais, B.; Wu, Z.; Walke, A.; Deshpande, V.; Rosseel, E.; Hikavyy, A.; Li, W.; Peng, L.; Rassoul, N.; Jamieson, G.; Inoue, F.; Verbinnen, G.; Devriendt, K.; Teugels, L.; Heylen, N.; Vecchio, E.; Zheng, T.; Waldron, N.; De Heyn, V.; Mocuta, D.; Collaert, N.
Source
2018 International Conference on IC Design & Technology (ICICDT) IC Design & Technology (ICICDT), 2018 International Conference on. :145-148 Jun, 2018
Subject
Language
Abstract
In this paper, we review the current progress on 3D sequential device stacking, highlighting the main integration challenges and the possible technological solutions. Next, we explore the potential benefits of 3D sequential stacking at transistor level, CMOS level and for hybrid circuits.