부산대학교 도서관

We present a high power density UV LED module for a wavelength of 395 nm with an optical power density of 27.3 W/cm 2 . The module consists of 98 densely packed LED chips soldered onto an Al 2 O 3 ceramic board. Thermal and optical measurements were conducted. The module was cooled by a forced air heat sink for the characterization experiments. A room temperature liquid gallium alloy was used as thermal interface material between substrate and heat sink with a TiN barrier layer to prevent corrosion. Further a technology to replace Al 2 O 3 ceramics by aluminum as substrate is presented. An initial characterization shows that aluminum with a dielectric layer for electrical insulation is a competitive substrate material for efficient heat removal.