학술논문
Nanostructured epoxy/POSS composites: enhanced materials for high voltage insulation applications
Document Type
Periodical
Author
Source
IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 22(3):1594-1604 Jun, 2015
Subject
Language
ISSN
1070-9878
1558-4135
1558-4135
Abstract
In this study, the dielectric and thermal properties of nanostructured epoxy/POSS (Polyhedral Oligomeric Silsesquioxanes) composites were investigated, using a reactive Triglycidylisobutyl-POSS (TGIB-POSS) additive from 1 up to 10 wt%. POSS has been successfully dispersed at a molecular level for low content composites, which show a remarkably improved resistance to corona discharges, with up to 60% less eroded sample volume, along with significantly increased dielectric breakdown strengths and thermal conductivities. Epoxy/POSS composites containing 5 wt% and more of the POSS additive exhibit agglomerations, which have been observed by SEM. Furthermore, dielectric spectroscopy revealed additional interfacial loss peaks for such composites containing 5 wt% POSS and more, in addition to the α- and β-peaks known for epoxy.