학술논문
Open-Access 3-μm SOI Waveguide Platform for Dense Photonic Integrated Circuits
Document Type
Periodical
Author
Source
IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 25(5):1-9 Jan, 2019
Subject
Language
ISSN
1077-260X
1558-4542
1558-4542
Abstract
This paper gives an overview of the 3-μm silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and mid-infrared applications. Specific benefits of this thick-SOI PIC platform include low optical losses (∼0.1 dB/cm), ultra-dense integration (μm-scale bends), small polarization dependency (down-to-zero birefringence), and ability to tolerate relatively high optical powers (>1 W). Fabrication technology is based on an i-line stepper and 150-mm wafer size. Open access to the waveguide platform is supported by design kits, wafer-level testing, multi-project wafer runs, dedicated R&D runs, and small-to-medium volume manufacturing.