학술논문

InAlN/GaN MISHEMTs With 120 nm T-Shape Recessed Gates on Silicon With Excellent mm-Wave Noise Performance
Document Type
Periodical
Source
IEEE Microwave and Wireless Technology Letters IEEE Microw. Wireless Tech. Lett. Microwave and Wireless Technology Letters, IEEE. 34(4):399-402 Apr, 2024
Subject
Fields, Waves and Electromagnetics
Logic gates
Noise measurement
MODFETs
HEMTs
Silicon
Optimized production technology
Substrates
GaN-on-Si
high electron mobility transistors (HEMTs)
InAlN/GaN
low noise
Language
ISSN
2771-957X
2771-9588
Abstract
InAlN/GaN metal-insulator-semiconductor high electron mobility transistors (MISHEMTs) with a 120 nm T-gate and gate recess on a silicon substrate were fabricated. A thin 1.5 nm HfO2 was prepared by plasma-enhanced atomic layer (PEALD) deposition as the gate dielectric. The high electron mobility transistors (HEMTs) exhibited a maximum drain current ( ${I} _{\text {dmax}}$ ) of 1.5 A/mm, a peak transconductance ( ${g} _{\text {mmax}}$ ) of 495 mS/mm, a cut-off frequency ( ${f} _{\text {T}}$ ) of 95 GHz, and a maximum oscillation frequency ( ${f} _{\text {max}}$ ) of 115 GHz. The fabricated MISHEMTs exhibited a minimum noise figure (NFmin) of 1.3 dB with an associated gain ( ${G} _{\text {a}}$ ) of 7.7 dB at 30 GHz, and NFmin of 1.7 dB and ${G} _{\text {a}}$ of 6 dB at 40 GHz. These excellent results show the great potential of the InAlN/GaN-on-Si HEMTs in the application of millimeter wave (mm-Wave) low noise amplifiers (LNAs).