학술논문

Electrical characterization of ultra-shallow junctions formed by plasma immersion implantation
Document Type
Conference
Source
2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400) Microelectronics Microelectronics, 2000. Proceedings. 2000 22nd International Conference on. 2:429-432 vol.2 2000
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Plasmas
Silicides
Voltage
Digital TV
Shape
Doping
Implants
Costs
Electric variables
Diodes
Language
Abstract
This work reports some electrical characteristics of ultra-shallow (/spl sim/90 nm) n/sup +/p junctions fabricated using plasma immersion implantation of arsenic ions. Both forward and reverse current-voltage (IV) characteristics at operation temperatures ranging from 100 to 450 K were measured. Results show that the ideality factor varies from unity to two indicating both diffusion and GR processes are important in these devices. The ideality factor is found to fluctuate with the temperature, indicating that discrete trap centers exist in these samples. Annealing has a profound effect on the reverse diode characteristics. For fully activated sample, the IV relationship essentially follows a power law, i.e I/spl prop/V/sup m/. The power index m/spl ap/3 and almost remains unchanged at different temperatures.