학술논문
Common Mode Return Loss Consideration in Wirebond Packaging for High Speed SerDes Links
Document Type
Conference
Author
Source
2006 IEEE Electrical Performane of Electronic Packaging Electrical Performance of Electronic Packaging, 2006 IEEE. :257-260 Oct, 2006
Subject
Language
ISSN
2165-4107
2165-4115
2165-4115
Abstract
This paper discusses the trade-offs in performance and cost of high speed SerDes in wirebond package applications. While many protocol standards specify requirements for both common mode return loss and differential mode return loss, meeting both sets of requirements in low cost wirebond packages requires the designer to make significant trade-offs. The performance and cost impacts of improving common mode return loss in wirebond packaging is examined from several different points of view.