학술논문
Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging
Document Type
Conference
Author
Source
2021 European Conference on Optical Communication (ECOC) Optical Communication (ECOC), 2021 European Conference on. :1-4 Sep, 2021
Subject
Language
Abstract
We report on glass-molded micro-optical interposers for single mode fiber-to-PIC coupling fabricated at the wafer scale that result in less than 1 dB excess insertion losses. They allow a narrow package footprint and can be extended to support polarization management, isolation and wavelength multiplexing.