학술논문
Low temperature metal-metal bonding for heterogeneous integration and performance scaling
Document Type
Conference
Author
Source
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :42-42 May, 2017
Subject
Language
Abstract
Au-Au based interconnect bonding (and Cu-Cu bonding) is advanced by addressing the roles of initial surface roughness, chemical mechanical polishing, bonding pressure and temperature. Focused ion beam sectioning through the bonded interface is used to determine grain growth, void evolution, and void faceting.