학술논문

Oxygen Vacancy Control as a Strategy to Enhance Imprinting Effect in Hafnia Ferroelectric Devices
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(1):354-359 Jan, 2023
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Capacitors
Annealing
Tantalum
Temperature measurement
FeFETs
Plasma temperature
Hysteresis
Bilayer capacitors
ferroelectric
Hf₀.₅Zr₀.₅O₂ (HZO)
high-pressure annealing (HPA)
imprinting effect
oxygen vacancy
tantalum oxide (TaO)
Language
ISSN
0018-9383
1557-9646
Abstract
Hafnia-based ferroelectric materials are recently drawing a significant attention for future electronic devices; however, there is a need to further enhance their functionality for practical applications. Especially, an imprinting effect has been regarded as a defect to be reduced in ferroelectrics; yet, it can be positively applied to various electronic devices with the functionality of self-rectifying behavior and threshold voltage adjustment. For the first time, we report a high imprinting effect in bilayer stack capacitors [TiN/Hf0.5Zr0.5O2 (HZO)/tantalum oxide (TaO)/TiN] by employing an optimal TaO insertion layer. Furthermore, the imprinting effect was enhanced by adopting high-pressure annealing (HPA) process. X-ray photoelectron spectroscopy (XPS) depth profile analysis reveals that the origin of the imprint field is the tantalum suboxides (Ta2O5-x) with doubly positively charged oxygen vacancies ( $\text{V}_{\text {o}}^{++}$ ). The imprint field increases with increasing HPA temperatures and achieved a high imprint field of 1.65 MV/cm at 600 °C. Moreover, endurance was observed up to 108 cycles without a breakdown while maintaining the original coercive fields up to 105 cycles. We also investigated how the TaO insertion layer with an imprint field influences the switching, interfacial, and ferroelectric properties. These findings on the imprinting effect provide a new strategy to improve the functionality of hafnia-based ferroelectric devices in the near future.