학술논문

Multipactor Suppression via 3D-Printed Conductors
Document Type
Conference
Source
2023 24th International Vacuum Electronics Conference (IVEC) Vacuum Electronics Conference (IVEC), 2023 24th International. :1-2 Apr, 2023
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Power transmission lines
Electric breakdown
Transmission line measurements
Conductors
Three-dimensional printing
Manufacturing
Electron emission
multipactor
coaxial
satellite
additive manufacturing
Language
Abstract
Preventing multipactor is essential for ensuring vacuum electronic systems operate reliably. Textured materials have previously been shown to significantly reduce secondary electron emission. However, these surface treatments are difficult to achieve inside of coaxial structures. Additive manufacturing can be used to produce textured components that can suppress multipactor. The multipactor breakdown threshold in such coaxial transmission lines was experimentally measured using two different 3D-printing technologies on two outer conductors. The partially 3D-printed transmission line was found to dramatically reduce multipactor (up to 2.9 dB increase in threshold power), and our experimental results consistently outperformed our simulations. This work demonstrates proof-of-concept for using 3D-printed materials for preventing multipactor.