학술논문
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding
Document Type
Conference
Author
Source
2023 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2023 IEEE International. :1-4 May, 2023
Subject
Language
ISSN
2836-4902
Abstract
We have attempted to study the nature of Copper (Cu)-electrode surfaces formed from two distinct Cu-electroplating baths with different additives. The phase-shift data obtained from the intermittent-contact atomic force microscopy analysis revealed the following that the soft Cuelectrode with higher tensile strength formed from modified Cu-electroplating possesses more reactive surface than the harder Cu-electrode formed from conventional Cu-electroplating. Thus, we inferred that this soft nature of Cu grains is also important for successful $\mathbf{Cu}-\mathbf{SiO}_{2}$ hybrid bonding, and it does play a vital role in realizing the seamless Cu-Cu interface in the Cu $\mu$ -joints formed by Cu-SiO 2 hybrid bonding.