학술논문
Study on the Correlation Between CMP CU Loading and EDP Curve
Document Type
Conference
Author
Source
2022 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2022 China. :1-3 Jun, 2022
Subject
Language
Abstract
Endpoint detection technology plays an important role in chemical mechanical polishing (CMP) technology, and is affected by many aspects in the actual production process. Because the Endpoint curve can directly reflect the process information, in-depth study of the endpoint curve can predict the health of the process in advance. Taking the AMAT machine as an example, this paper focuses on the influence mechanism of Cu CMP incoming profile such as CU loading on Endpoint, and discusses how to improve endpoint stability to reduce the probability of endpoint capture failure.