부산대학교 도서관

The smaller size, higher integration, higher power density and higher reliability has become the development trends of power electronics, but at the same time, the heat dissipation issue of power devices is more serious. In order to improve system reliability, the heat generated by the power devices should be quickly and efficiently transferred to the external environment. The soldering interface of the power chip has the function of conduction, support and heat dissipation. The soldering interface of the die is the key interface in the heat flow path from the die to the heat sink. If there are voids or delamination on the soldering interface, the heat transfer will be blocked and the thermal resistance of the device will increase, causing local overheating of the chip, and ultimately causing the power module to activate thermal protection or the power chip to overheat and burn out. In this paper, a failure analysis has been carried out on power electronic module whose failure was due to die soldering voids, the (3D)X-Ray and finite element simulation had been used. The purpose is to clarify the failure mechanism, summarize the influence law of soldering voids, and propose improvement measures (vacuum reflow soldering, low-temperature sintering nano-silver technology, etc.) to improve product reliability.