부산대학교 도서관

Ceramic packaging is the main packaging technology that meets the demand for high reliability. However, the ceramic is a kind of brittle material with low toughness and ductility, and is easy to stress damage. The ceramic micro-cracks directly lead to the breaking of the metal interconnection, which has become a typical failure mode of ceramic packaged devices. In this paper, failure analysis on ceramic packaged device was studied through electrical failure localization, 3D X-Ray, SAM, mechanical polishing, etc., and general failure analysis method was proposed. The result shows that the sources of damage include external mechanical stress and micro-crack defects; the non-destructive method is critical in localizing cracks, most of this kind of failure can be screen out during temperature stress test. People need to pay attention to avoid this kind failure during production or use, and improve product reliability.