학술논문
Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation
Document Type
Conference
Author
Source
2013 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2013 IEEE International. :1-6 Oct, 2013
Subject
Language
Abstract
This paper discusses important aspects of development process of dedicated test vehicles designed for investigation on thin metal layers reliability by a novel Accelerated Thermo-Mechanical Ageing method (ATMA) [1] being developed now. It is an ongoing research report presenting current state of the R&D works, investigation on ATMA usefulness and its applicability to interconnect reliability evaluation.