학술논문
Towards the Extension of TRIC for Thermo-Mechanical Analysis
Document Type
Conference
Author
Source
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2021 27th International Workshop on. :1-5 Sep, 2021
Subject
Language
ISSN
2474-1523
Abstract
In this paper, an extension of the existing Thermal Resistance and Impedance Calculator (TRIC) tool is proposed, which allows an efficient, yet accurate, computation of thermomechanical stress under stationary conditions in any specimen of a family of electronic packages. Each thermo-mechanical model is automatically generated and quickly solved by using a multigrid iteration solver and an ad hoc projection-based approach. An exposed quad-flat package is investigated as a case-study.