학술논문

HEMT Average Temperature Determination Utilizing Low-Power Device Operation
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(10):5484-5489 Oct, 2022
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Temperature measurement
HEMTs
Logic gates
Isothermal processes
Thermal resistance
Temperature distribution
Temperature dependence
AlGaN
average channel temperature
charge trapping
FET
GaN
HEMT
Language
ISSN
0018-9383
1557-9646
Abstract
The modified thermal device model was adapted to determine the channel temperature of the AlGaN/GaN HEMT operating under pulsed and quasi-static conditions. The differential analysis of the isothermal and thermal part of the resulting current, as well as ambient temperature variation, is utilized to determine the average channel temperature. Ambient temperature increases in the device operating range is required under low-power operation only, while under high-power operation the thermal stress of the device is significantly reduced due to small ambient temperature variation. In addition, trapping phenomena incorporation is demonstrated to obtain more accurate results utilizing the HEMT threshold voltage shift and transconductance. For experimental verification of the thermal model, Al0.25Ga0.75N/GaN HEMT electrical properties are investigated. Experimentally verified results are in a good agreement with numerical simulations.