학술논문
Evaluation of Failure Mechanisms in Low Thermal Resistance Interface Materials for Reliable Electronics Applications
Document Type
Conference
Source
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2021 27th International Workshop on. :1-6 Sep, 2021
Subject
Language
ISSN
2474-1523
Abstract
Thermal interface materials are critical for heat dissipation and thus reliable operation of many electronic parts. Considering future challenges such as autonomous driving, reliability is a key factor for safety and performance. This work studies various failure mechanisms which can occur in polymeric thermal interface materials. Each failure mechanism is linked to an experimental setup/method that may help to gain indications for material screening purposes. Various product classes are screened and put into perspective and benefits of each one of these product classes are discussed.