학술논문

6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters
Document Type
Conference
Source
2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International. :120-121 Feb, 2014
Subject
Components, Circuits, Devices and Systems
General Topics for Engineers
Field programmable gate arrays
Integrated circuit interconnections
Clocks
CMOS integrated circuits
Frequency measurement
Bandwidth
Arrays
Language
ISSN
0193-6530
2376-8606
Abstract
Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing channel count and higher sample rate means this IO interface is becoming a limiting factor in the system budget with respect to interconnect complexity and associated power. The integration of flexible data converters with FPGA eliminates this IO cost and also offers a dynamically scalable, power efficient platform solution that addresses diverse application needs.