학술논문
3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform
Document Type
Conference
Author
Bian, Yusheng; Ramachandran, Koushik; Peng, Bo; Hedrick, Brittany; Donegan, Keith; Lubguban, Jorge; Fasano, Benjamin; Rundquist, Armand; Pape, Jim; Sahin, Asli; Houghton, Thomas; Nummy, Karen; Steffes, Jay; Medina, Louis; Roy, Subharup Gupta; Cox, Harry; Green, Bart; Dezfulian, Kevin; Lee, Won Suk; Stricker, Andy; Mclean, Kate; Hu, Shuren; Sowinski, Zoey; Meagher, Colleen; Aboketaf, Abdelsalam; Rakowski, Michal; Randall, Mai; Melville, Ian; Riggs, Dave; Jacob, Ajey; Augur, Rod; Berger, Daniel; Yu, Anthony; Giewont, Ken; Pellerin, John
Source
2020 IEEE Photonics Conference (IPC) Photonics Conference (IPC), 2020 IEEE. :1-2 Sep, 2020
Subject
Language
ISSN
2575-274X
Abstract
A hybrid laser attach technology was demonstrated on GLOBALFOUNDRIES 300-mm monolithic silicon photonics (SiPh) platform. High accuracy bonding of laser inside a cavity in the SiPh die was accomplished. Optical power up to 10dBm was demonstrated through direct butt-coupling of the laser to SiPh die.